12英寸的方形SiC晶圆曝光

Core Viewpoint - The article discusses the advancements and challenges in the silicon carbide (SiC) wafer market, particularly focusing on GlobalWafers' development of 12-inch square SiC wafers and the competitive landscape influenced by pricing pressures from Chinese manufacturers [1][2]. Group 1: Company Developments - GlobalWafers has announced the capability to develop 12-inch square SiC wafers, which requires not only process capabilities but also new equipment due to the lack of existing solutions [1]. - The company has developed a cutting method for 12-inch SiC wafers that does not rely on laser technology, differentiating itself from competitors [1]. - GlobalWafers anticipates launching its 12-inch SiC wafers this year, aiming to penetrate application fields directly [1]. Group 2: Market Dynamics - The pricing of 6-inch SiC wafers has seen the most significant decline, followed by 8-inch wafers, with the overall market facing intense competition and price pressures [2]. - GlobalWafers' revenue from SiC is expected to remain below 10% of total revenue next year, despite volume growth, indicating ongoing challenges with average selling prices (ASP) [2]. - The SiC market is compared to the solar energy sector, where prices are dropping but demand is expected to grow due to the material's superior performance in high-voltage and heat dissipation applications [2]. Group 3: Competitive Landscape - Wolfspeed, a major player in the SiC market with a 33% global market share, faces challenges due to high production costs and aggressive pricing from Chinese competitors [2][3]. - If Wolfspeed struggles, customers may seek alternatives, presenting an opportunity for GlobalWafers to capture market share [3]. - Infineon has successfully developed 12-inch SiC wafers, which could enhance its competitiveness in the electric vehicle market and other applications, indicating a trend towards larger wafer sizes in the industry [3].