HBM，另一场混战

Core Viewpoint - The competition among SEMECS, Hanwha Semiconductor, and Hanmi Semiconductor in the high bandwidth memory (HBM) core semiconductor equipment market, specifically the TC Bonder, is intensifying as they accelerate preparations for mass production of hybrid bonding machines, which are expected to be partially adopted in the production of the sixth generation HBM (HBM4) [1][2] Group 1: Hybrid Bonding Machine Development - The hybrid bonding machine is considered a "game changer" for the next generation HBM market, as it connects chips without the need for separate bumps, allowing for the manufacturing of stacked chips with 20 layers or more, thereby minimizing signal loss and enhancing semiconductor performance [2] - Hanwha Semiconductor plans to launch its hybrid bonding machine early next year, having recently showcased its advanced semiconductor packaging equipment development roadmap at the SEMICON Taiwan 2025 exhibition [2] - Hanmi Semiconductor is investing heavily in the hybrid bonding machine sector, constructing a factory in Incheon with an area of approximately 14,600 square meters, expected to be completed in the second half of next year [2] Group 2: Market Dynamics and Competition - The main view in the industry is that the technology stability of the hybrid bonding machines developed by Applied Materials and Dutch company Besi is superior to that of domestic Korean companies, with these machines already being tested by Samsung Electronics and Micron [3] - The price of these hybrid bonding machines is a significant concern, as they are reported to be more than twice the cost of existing bonding machines, prompting Samsung Electronics and SK Hynix to seek a multi-supplier system to reduce procurement costs [3] - According to Verified Market Research, the global hybrid bonding machine market is expected to grow from approximately 7 trillion KRW in 2023 to 20 trillion KRW by 2033, driven by increasing demand for HBM [3]