SK海力士完成全球首款HBM4开发，准备量产

Core Viewpoint - SK Hynix has announced the completion of the development of the world's first ultra-high-performance AI next-generation storage product, HBM4, and is ready for mass production [1][3]. Group 1: Product Development and Features - HBM (High Bandwidth Memory) is a high-value, high-performance memory that significantly increases data processing speed by vertically stacking multiple DRAM chips compared to traditional DRAM products [3]. - HBM4 has doubled the bandwidth by utilizing 2,048 I/O terminals, which is twice that of the previous generation, and has improved power efficiency by over 40%, achieving the best data processing speed and power efficiency in the industry [5]. - The operating speed of HBM4 exceeds 10 Gbps, far surpassing the JEDEC standard operating speed of 8 Gbps [5]. - The Advanced MR-MUF process and 1bnm process (fifth-generation 10nm technology) have been implemented in HBM4 to minimize mass production risks [5]. Group 2: Market Demand and Impact - There is a surge in demand for higher bandwidth memory due to the rapid growth of AI needs and data processing, which is essential for achieving faster system speeds [3]. - HBM4 is expected to enhance AI service performance by up to 69%, helping to alleviate data bottlenecks and significantly reduce data center power costs [5]. - The company aims to supply products that meet customer demands in performance, power efficiency, and reliability, thereby maintaining a competitive edge in the market [3][5]. Group 3: Strategic Vision - SK Hynix positions HBM4 as a symbolic turning point in overcoming the limitations of AI infrastructure and aims to become a full-stack AI storage provider by supplying high-quality, diverse performance storage products [6].