液冷新风向？英伟达要求供应商开发新技术

Core Insights - AI-driven advancements are pushing the continuous iteration of liquid cooling technology, particularly with the introduction of the microchannel liquid cooling plate (MLCP) technology, which is expected to become a strategic material for cooling solutions in AI servers [1][2] Group 1: Technology Development - The power consumption of the Rubin GPU is expected to increase from 1.8kW to 2.3kW, exceeding the current cooling plate capacity, prompting NVIDIA to implement MLCP by the second half of 2026 [2] - MLCP technology integrates the metal cover on the chip with the liquid cooling plate, featuring microchannels that allow cooling liquid to flow directly over the chip, enhancing heat transfer efficiency and reducing volume [1] Group 2: Market Implications - The cost of MLCP is projected to be 3 to 5 times higher than existing cooling solutions, with manufacturing costs potentially increasing by 5 to 7 times compared to the current Blackwell cover if GPUs fully transition to MLCP [1][2] - Boyd, a supplier for NVIDIA, has delivered 5 million liquid cooling plates to large-scale data centers, indicating a growing demand for high-performance AI computing cooling solutions [2]