Core Viewpoint - SK Hynix has announced the readiness for mass production of its next-generation high bandwidth memory (HBM4) chips, positioning itself ahead of competitors and marking a significant milestone in the industry [2][3]. Group 1: HBM4 Technology and Features - HBM4, the fourth generation of HBM, features 2,048 input/output terminals, doubling the bandwidth compared to previous versions, and includes new power management and RAS functionalities [2]. - The operational speed of HBM4 exceeds 10 Gbps, significantly surpassing the JEDEC standard of 8 Gbps [2]. - SK Hynix's HBM4 is expected to enhance AI service efficiency by up to 69% while improving energy efficiency by over 40% compared to the previous generation [3]. Group 2: Market Position and Competition - SK Hynix is set to establish the world's first HBM4 mass production system, solidifying its leadership in the HBM market [4]. - Analysts predict that SK Hynix will maintain a market share of approximately 50% in the HBM sector by 2026, despite the entry of competitors like Samsung and Micron [4]. - The pricing of HBM4 is expected to be 60% to 70% higher than the previous generation, with potential price reductions occurring only after competitors enter the market [4].
HBM龙头,市占50%
半导体芯闻·2025-09-15 09:59