行业聚焦：全球AI服务器PCB市场头部企业份额调研（附Top10 厂商名单）

Core Viewpoint - The global AI server PCB market is projected to reach $12.08 billion by 2031, with a compound annual growth rate (CAGR) of 6.7% in the coming years [1]. Market Overview - The AI server PCB market is primarily driven by the surge in demand for AI-optimized servers and the rapid expansion of data centers and cloud infrastructure [11]. - The top five manufacturers hold approximately 48.2% of the market share, with major players including Guanghe Technology, Jianding Technology, and Jinxiang Electronics [6][16]. Product Type Segmentation - Multi-layer PCBs dominate the market, accounting for about 58.4% of the total share [8]. - High-density interconnect (HDI) boards are also significant in the product mix [16]. Application Segmentation - Data centers and cloud computing represent the largest downstream market, capturing approximately 49.5% of the demand for AI server PCBs [9]. Industry Drivers and Challenges - The explosive growth of generative AI and AI-driven workloads is a key driver for unprecedented demand for AI servers [11]. - Challenges include maintaining signal integrity for high-speed interconnections and the high costs associated with materials and manufacturing processes [11]. Industry Opportunities - The need for high-speed interconnections presents opportunities for advanced PCB technologies, such as HDI, SLP, and mSAP, which meet the requirements for high layer counts and low-loss materials [12]. Industry Chain Structure - The industry chain consists of upstream raw materials (e.g., copper-clad laminates, copper foil), midstream PCB manufacturers focusing on high-performance products, and downstream applications in AI server manufacturers and cloud computing [15].