中国先进封装模塑封材料（EMC）企业布局

Core Viewpoint - The article emphasizes the growing demand for advanced packaging materials in the semiconductor industry, particularly focusing on the evolution of molding compounds and the challenges posed by new technologies and applications [2][6]. Group 1: Advanced Packaging Applications - The shift from traditional wire bonding packaging to advanced packaging methods such as wafer-level packaging, panel-level packaging, 2.5D/3D heterogeneous integration, and system-level packaging requires molding compounds to have higher flatness, lower warpage, and better fine-pitch filling capabilities [2]. - The increasing frequency and speed requirements from applications like 5G and AI necessitate low dielectric constant and low dielectric loss molding compounds to minimize signal transmission delays and losses [3]. Group 2: Thermal Management and Reliability - Power devices, such as IGBTs used in electric vehicles, generate significant heat, leading to a need for ultra-high thermal conductivity molding compounds [4]. - Industries like automotive electronics and aerospace demand components that can operate in extreme environments for over 15 years, placing extreme reliability requirements on materials [5]. Group 3: Environmental Considerations - There is a push towards developing more environmentally friendly formulations, such as halogen-free, antimony-free, and bio-based materials, in response to sustainability concerns [6]. Group 4: Market Landscape - China, as a leading player in the global packaging and testing manufacturing industry, has the largest demand for epoxy molding compounds, yet local supply capabilities are limited, particularly for mid-to-high-end products like wafer-level packaging materials, which still rely on imports or foreign enterprises' production bases in China [6]. - Currently, there are 18 major enterprises competing in the packaging molding materials market in China, with total annual production capacity exceeding 210,000 tons [6]. Group 5: Industry Events and Collaboration - TrendBank plans to hold the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on cutting-edge heterogeneous integration technologies and aiming to foster collaboration within the advanced electronic information industry [7][8].