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Core Viewpoint - Huawei is leading a new paradigm in AI infrastructure with its innovative supernode interconnection technology, emphasizing the importance of computing power in artificial intelligence development [2][3]. Group 1: Ascend Chip Development - Huawei has made significant progress in its Ascend chip series, with the upcoming Ascend 950 series expected to enhance AI computing capabilities [3][4]. - The Ascend 950 series includes two chips: Ascend 950PR and Ascend 950DT, which will improve training efficiency and inference throughput [5][6]. - The Ascend 950PR chip targets inference prefill and recommendation scenarios, while the Ascend 950DT focuses on inference decode and training, with significant improvements in memory bandwidth and capacity [6][7]. Group 2: Supernode Products - The Atlas 950 supernode, based on the Ascend 950DT chip, will support 8192 Ascend 950DT chips, significantly increasing computing power and interconnection bandwidth [9][10]. - The Atlas 960 supernode, set to launch in 2027, will further enhance performance with a maximum support of 15488 cards, doubling the capabilities of the Atlas 950 [11][12]. - The Atlas 950 SuperCluster will consist of 64 Atlas 950 supernodes, achieving a total computing power of 524 EFLOPS, making it the world's strongest computing cluster [21][22]. Group 3: Interconnection Technology - Huawei has developed a new interconnection protocol, "Lingqu," to support large-scale supernode architectures, enhancing reliability and bandwidth [20][23]. - The interconnection technology addresses challenges in long-distance, high-reliability connections and aims to achieve TB-level bandwidth with low latency [19][20]. - The Lingqu protocol will be open for industry partners to foster collaboration and innovation in interconnection technology [20][23].