Core Viewpoint - Samsung Electronics has achieved a significant milestone by successfully entering NVIDIA's HBM supply chain with its 12-layer HBM3E product, following rigorous certification [1]. Group 1: Technical Challenges and Solutions - Samsung faced initial setbacks in entering NVIDIA's HBM supply chain due to thermal issues in its HBM3 products, which were traced back to design flaws in its DRAM technology [3]. - To overcome these challenges, Samsung made substantial optimizations to its DRAM chip design, addressing previous thermal and performance bottlenecks, and invested heavily in upgrading production lines and expanding R&D teams [3]. Group 2: Future Prospects and Market Positioning - Currently, NVIDIA's HBM supply is primarily dependent on SK Hynix and Micron, limiting Samsung's initial order scale for the 12-layer HBM3E [4]. - Samsung aims to leverage this breakthrough as a stepping stone towards the next-generation HBM4 technology, having developed HBM4 products with a data transfer rate of 11Gbps, making it the first company to achieve this [4]. - The company plans to expand its HBM4 supply chain to major tech giants like AMD, Broadcom, and Google, which will open new growth opportunities in various sectors including PC processors, network chips, and cloud computing [4].
三星重大突破！ 暴露 HBM4 供应体系的野心！
是说芯语·2025-09-21 07:25