全球与中国TGV基板市场现状及未来发展趋势

Core Viewpoint - The article discusses the current status, trends, and market dynamics of Through-Glass Via (TGV) substrates, highlighting their potential in semiconductor packaging and microelectronics, particularly in data centers, 5G networks, and IoT devices. The TGV technology is positioned as a promising alternative to traditional silicon-based substrates, with significant growth expected in the coming years [1][7][12]. Group 1: Current Status of TGV Substrate Industry - TGV substrate production is primarily concentrated in the US, Europe, and Japan, with China lagging in high-end TGV technology and lacking independent intellectual property rights [3][12]. - Major international players like Corning and LPKF dominate the mid-to-high-end market, collectively holding over 50% market share [3][12]. - Domestic companies such as Xiamen Yuntian Semiconductor are emerging rapidly in the mid-to-low-end TGV substrate market, leveraging cost advantages for import substitution [3][12]. - Companies can be categorized into three types based on their product strategies: those with established R&D capabilities, those diversifying their product lines, and those focusing on niche markets [4][12]. Group 2: Development Trends of TGV Substrates - The trend towards smaller via sizes is driven by the demand for high-density interconnections, enhancing circuit integration and performance [5]. - The future development trend indicates a shift towards larger 300 mm wafer sizes, expected to capture 73.46% of the global market share by 2031 [5][6]. - The Asia-Pacific region, particularly China and Japan, is projected to experience rapid growth, with market shares of 14.97% and 9.42% respectively by 2031 [5][6]. Group 3: Global Market Scale Analysis - The global TGV substrate market is expected to grow from $12.3 million in 2024 to $47.5 million by 2031, with a compound annual growth rate (CAGR) of 20.24% from 2025 to 2031 [7][10]. - In 2024, the Chinese TGV market is projected to reach $2.54 million, accounting for 20.62% of the global market, and is expected to grow to $13.21 million by 2031 [10]. - The consumer electronics sector is the largest application market for TGV substrates, accounting for 63.91%, followed by the automotive industry at 21.10% [11][12]. Group 4: Market Structure and Competition - The TGV substrate market is highly concentrated, with leading manufacturers like Corning and LPKF holding 50% of the market share, while the second tier, including Samtec and Xiamen Yuntian Semiconductor, holds 33.86% [12]. - The market faces challenges such as high production costs and complex manufacturing processes, which hinder scalability and efficiency [12]. - Companies need to optimize production processes, increase R&D investment, and enhance market awareness to maintain competitiveness in the evolving landscape [12]. Group 5: Policy Analysis - The "5G Application - Sailing Action Plan (2021-2023)" aims to enhance 5G technology capabilities and support the development of key components, which will indirectly benefit the TGV substrate market [13][14]. - The plan emphasizes the importance of advancing 5G infrastructure and related technologies, which aligns with the growth potential of TGV substrates in high-frequency applications [13][14]. Group 6: Report Overview - The article references a comprehensive report by QYResearch that analyzes the global and Chinese TGV substrate market, covering production capacity, sales, pricing, and future trends from 2025 to 2031 [15][16]. - The report includes detailed insights into major manufacturers, product types, applications, and regional analyses, providing a thorough understanding of the market dynamics [15][16].