下一代GPU，竞争激烈

Core Viewpoint - NVIDIA and AMD are competing to develop superior AI architectures, with significant upgrades planned for their next-generation products in terms of power consumption, memory bandwidth, and process node utilization [2][3]. Group 1: AI Product Competition - AMD's Instinct MI450 AI series is expected to compete fiercely with NVIDIA's Vera Rubin, with both companies making substantial modifications to their designs [2][5]. - AMD executive Forrest Norrod expressed optimism about the MI450 product line, likening it to AMD's transformative "Milan moment" with the EPYC 7003 series [3]. - The MI450 is projected to be more competitive than NVIDIA's Vera Rubin, with AMD planning to leverage its own technology stack for future products [3]. Group 2: Technical Specifications - The MI450X's Total Graphics Power (TGP) has increased by 200W, while the TGP for Rubin has risen by 500W to 2300W, indicating a response to market competition [5]. - Memory bandwidth for Rubin has improved from 13 TB/s to 20 TB/s per GPU, showcasing the enhancements made in both product lines [5]. - AMD's MI450 is rumored to feature HBM4 memory with up to 432 GB per GPU, while NVIDIA's Rubin is expected to have around 288 GB per GPU [6]. Group 3: Interconnect Technology - AMD plans to significantly enhance its chip-to-chip (D2D) interconnect technology with the upcoming Zen 6 processors, as evidenced by developments in the Strix Halo APU [8][10]. - The new D2D interconnect method reduces power consumption and latency by eliminating the need for serialization/deserialization, thus improving overall bandwidth [12][15]. - The Strix Halo's design utilizes TSMC's InFO-oS technology and redistribution layers (RDL) to facilitate efficient communication between chips [10][15].