Core Viewpoint - The article discusses the development and trends in the semiconductor packaging industry, particularly focusing on the plastic packaging machines, highlighting the growth potential in the Chinese market and the shift towards advanced packaging technologies. Group 1: Semiconductor Packaging Process - The semiconductor production process includes wafer manufacturing, testing, packaging, and testing, with packaging being crucial for electrical and signal connections as well as physical protection of integrated circuits [1] - The encapsulation process involves injecting packaging materials into molds to protect semiconductor chips, which is essential due to environmental conditions that could lead to chip failure [1] Group 2: Industry Development Overview - China is actively promoting the integrated circuit industry as a strategic pillar, with a focus on high-quality development and self-sufficiency in manufacturing processes, equipment, and materials [4] - The domestic integrated circuit market is experiencing steady growth, supported by strong internal demand and a clear trend towards domestic substitution, despite global economic fluctuations [4] Group 3: Characteristics of the Semiconductor Packaging Machine Industry - The trend towards high reliability in packaging machines is becoming critical, especially for automotive and industrial-grade chips, where performance metrics like temperature control and operational consistency are essential [6] - Advanced packaging technologies are driving the need for equipment upgrades, with T-Molding and C-Molding market shares expected to diverge [7][8] Group 4: Automation and Localization - The introduction of automation and intelligence in packaging machines enhances efficiency and consistency, reducing reliance on manual labor [9] - The demand for domestic equipment is increasing as local semiconductor companies expand their production capacities, with several emerging firms gaining market share [9] Group 5: Market Size and Forecast - The global semiconductor packaging machine market is projected to reach USD 406 million in 2024, with a compound annual growth rate (CAGR) of 6.59% expected until 2031 [11] - The Chinese market is anticipated to grow from USD 179 million in 2024 to USD 275 million by 2031, representing approximately 44% of the global market [11] Group 6: Market Share and Key Players - Major players in the international market include Towa, Besi, ASMPT, and Sanan Optoelectronics, with the top five companies holding about 80.79% of the market share [15] - In the Chinese market, the leading companies also include Towa, Besi, ASMPT, and Sanan Optoelectronics, with the top five accounting for approximately 77.24% of the market [15] Group 7: Policy Support - The Chinese government has implemented various policies to support the semiconductor industry, including tax incentives for companies involved in integrated circuit design, equipment, materials, packaging, and testing [16][17][18]
全球半导体塑封机行业总体规模、主要企业国内外市场占有率及排名
QYResearch·2025-09-29 01:56