Core Viewpoint - The article highlights the recent submission of a listing application by Hefei Jinghe Integrated Circuit Co., Ltd. to the Hong Kong Stock Exchange, aiming to enhance the domestic semiconductor industry and expand its market presence globally [1]. Group 1: Company Overview - Hefei Jinghe Integrated Circuit Co., Ltd. specializes in semiconductor manufacturing, with products including logic chips, memory chips, and specialty process chips, applicable in smart terminals, automotive electronics, and the Internet of Things [1]. - The company has a strong market competitiveness in the domestic wafer foundry sector, achieving breakthroughs in advanced processes and specialty technologies through continuous R&D and capacity expansion [3]. Group 2: Production Capabilities - The company is recognized as a global leader in 12-inch pure wafer foundry, offering wafer foundry services across process nodes from 150nm to 40nm, and is steadily advancing its 28nm platform [4]. - According to Frost & Sullivan, from 2020 to 2024, the company is projected to have the fastest capacity and revenue growth among the top ten global wafer foundry enterprises, ranking ninth globally and third in mainland China by revenue in 2024 [4]. - The company has established mass production capabilities across technology nodes from 150nm to 40nm, with a diverse process platform that includes DDIC, CIS, PMIC, Logic IC, and MCU technologies, supporting its leading position in key market segments [4]. Group 3: Technological Advancements - The company is enhancing its process technology and optimizing product structure, having commenced trial production of 28nm Logic ICs and initiated risk production of 40nm high-voltage OLED DDICs [4]. - It has achieved mass production of 55nm mid-to-high-end back-illuminated image sensors and 55nm full-process stacked CIS, while steadily advancing the R&D of other 28nm wafer foundry solutions, including OLED DDIC [4].
合肥晶合集成拟赴港上市!