第三届集成芯片和芯粒大会倒计时2天！

Core Viewpoint - The Third Integrated Chip and Chiplet Conference will be held from October 10-13, 2025, in Wuhan, focusing on collaborative design and packaging to advance chip technology [1]. Event Overview - The conference is organized by Wuhan University, the Institute of Computing Technology of the Chinese Academy of Sciences, and Fudan University, featuring 7 keynote speeches and 16 technical forums [1]. - The theme is "Design and Packaging Collaboration, Building the Future of Chips," aiming to foster discussions on cutting-edge topics such as 3D integration, heterogeneous integration, multi-physical field collaboration, high-speed interconnects, EDA design methods, and advanced storage and packaging technologies [1]. Schedule Highlights - The opening ceremony will take place on October 11, 2025, followed by various sessions including: - Keynote on cutting-edge technology research in integrated chips [1]. - Forums addressing topics like storage and computing integration, multi-physical field simulation, and thermal management technologies [4]. - Notable speakers include experts from prestigious institutions such as the Chinese Academy of Sciences and Fudan University [4][1]. Participation Information - Registration for the conference can be completed online or on-site, with a countdown of only 2 days remaining until the event [5].