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投资70亿美金,美国一座先进封装厂开工

Core Insights - Amkor Technology announced a significant investment to build a state-of-the-art semiconductor advanced packaging and testing campus in Arizona, increasing total investment to over $7 billion [2][3] - The project aims to enhance U.S. semiconductor leadership and will create up to 3,000 high-quality jobs [2][3] Investment Details - The expansion includes new cleanroom space and a second packaging factory, with a total investment exceeding $5 billion, bringing the overall investment to $7 billion [2] - The project will be implemented in two phases, with the first production facility expected to be completed by mid-2027 and operational by early 2028 [2] Strategic Importance - The new campus will focus on advanced packaging and testing technologies, complementing TSMC's front-end wafer manufacturing, thus establishing a complete domestic semiconductor manufacturing ecosystem [3] - The facility is strategically located in Arizona's high-tech corridor, leveraging local talent, infrastructure, and industry clusters [3] Industry Support - The project has received support from the CHIPS for America Program and advanced manufacturing investment tax credits [2] - Key industry leaders, including executives from Apple and NVIDIA, expressed their support, highlighting the importance of this investment for the U.S. semiconductor supply chain and innovation [3]