国泰海通｜电子：AI发展，热管理的核心瓶颈向芯片聚焦

Core Insights - The demand for thermal interface materials (TIM) is expected to grow rapidly due to the increasing need for cooling technologies in high-density computing centers, particularly in the context of artificial intelligence and advanced chip designs [1][2]. Group 1: AI Development and Thermal Management - The evolution of AI applications is driving new challenges for data centers, which are transitioning towards high-density, intelligent, and sustainable architectures [2]. - AI servers, such as NVIDIA's GB200/GB300 NVL72 systems, exhibit significantly increased power consumption, with a total design power (TDP) reaching 130kW-140kW per rack [2]. - Approximately 55% of failures in electronic systems are attributed to thermal issues, highlighting the importance of effective thermal management across various components in data centers [2]. Group 2: Power Consumption of Computing Chips - The power consumption of computing chips is on the rise, with NVIDIA's 4nm H20 chip having a TDP of 400W and the B300 chip reaching 1400W [3]. - Projections indicate that by 2027, the power consumption of AI chips could exceed 2kW, leading to challenges such as chip warping, which may reach 0.3mm [3]. Group 3: Thermal Interface Materials (TIM) - There is an urgent need for higher-performance solutions in thermal interface materials, which are evolving from traditional silicone-based compounds to advanced materials [4]. - TIMs are categorized into TIM1, TIM1.5, and TIM2, each serving different roles in heat dissipation, with TIM1 requiring a thermal conductivity of over 15W/mK [4]. - The materials used in TIMs include polymers, boron nitride, aluminum nitride, and graphene, with applications in phase change materials and indium sheets [4].