中欣晶圆启动上市辅导

Core Viewpoint - Hangzhou Zhongxin Jingyuan Semiconductor Co., Ltd. has completed the IPO guidance filing with the Zhejiang Securities Regulatory Bureau and plans to list on the Beijing Stock Exchange [1] Group 1: Company Overview - Hangzhou Zhongxin Jingyuan was established in September 2017 with a registered capital of 5.032 billion yuan [2] - The legal representative is He Xianhan, and the major shareholders are Hangzhou Dahe Thermoelectric Co., Ltd. (14.41%) and Shanghai Shenhe Investment Co., Ltd. (8.64%) [2] - The company has integrated its operations to form a group headquartered in Hangzhou, producing a complete range from semiconductor single crystal rod pulling to 4-12 inch semiconductor wafer processing [2] Group 2: Product and Market Position - Zhongxin Jingyuan's main products include 8-inch and 12-inch polished wafers, as well as epitaxial wafers, with applications in logic chips, flash memory chips, dynamic random-access memory chips, image sensors, and display driver chips [2][3] - The company applied for listing on the New Third Board's innovation layer on June 25, 2025, and received acceptance notification on June 30, 2025 [3]