Chiplet，改变了芯片

Core Viewpoint - The article discusses the evolution of semiconductor technology, highlighting the shift from Moore's Law to chiplet technology as a solution to the challenges faced in semiconductor manufacturing [2][5]. Summary by Sections Moore's Law and Its Challenges - Moore's Law, proposed by Gordon Moore in 1965, states that the number of transistors on a semiconductor chip doubles approximately every two years, driving performance improvements and cost reductions [2]. - Recent advancements in chip manufacturing have faced physical limits, increased complexity, and rising costs, leading to a belief that Moore's Law may no longer be applicable [2]. Introduction of Chiplets - Chiplets are small chips that perform specific functions and can be combined into a single package, improving manufacturing yield and efficiency by allowing the use of "known good die" [2]. - This technology allows for the integration of different types of circuits, enhancing performance while maintaining cost-effectiveness, particularly in high-performance computing and automotive applications [3]. Heterogeneous Integration - Heterogeneous integration enables the combination of chips made with different processes and functionalities into a single package, which is particularly beneficial for the automotive industry [3]. - Major automotive manufacturers are exploring chiplet technology for future vehicle systems, aiming for mass production post-2030 [3]. Advantages Beyond Automotive - Chiplet technology is expanding into artificial intelligence and telecommunications, driving innovation across various industries [5]. - The technology relies on an intermediary layer that connects chips, enhancing communication speed and efficiency [5]. Advanced Packaging Techniques - The mainstream method for chiplet integration is 2.5D integration, while the next significant advancement is 3D integration, which stacks chips vertically for higher density [5][8]. - Combining flexible chip designs with 3D integration allows for faster, smaller, and more energy-efficient semiconductors, crucial for high-performance applications [7]. Challenges and Innovations - Vertical stacking of chips presents challenges such as heat management and maintaining high manufacturing yields, prompting research into advanced packaging technologies [8]. - The combination of chiplets and 3D integration is viewed as a disruptive innovation that could lead the semiconductor industry into a new era, potentially replacing Moore's Law [8].