先进封装推动，后端芯片设备增长迅猛

Core Viewpoint - The semiconductor backend equipment market is entering a new era, transitioning from cost-sensitive processes to advanced packaging technologies and increasingly complex semiconductor devices. The market size is expected to grow from $6.9 billion in 2025 to $9.8 billion by 2030, with a compound annual growth rate (CAGR) of 7.1% [1]. Market Dynamics: Transformation through Complexity - The semiconductor manufacturing industry is rapidly evolving, with the backend being central to this transformation. Factors such as chip architecture, heterogeneous integration, and the rise of High Bandwidth Memory (HBM) are driving demand for new equipment [2]. Backend Semiconductor Equipment: Growth Prospects by Segment - Core backend equipment segments include die bonders, flip chip bonders, thermal compression bonders (TCB), hybrid bonding, wire bonding, wafer thinning, cutting, and metrology and inspection. Advanced technologies like TCB and hybrid bonding are key to driving significant changes, while traditional solutions like wire bonding still hold market potential [5][6]. TCB: Rapid Rise - TCB is gaining prominence due to its critical role in advanced packaging, especially in HBM integration. Revenue is expected to reach approximately $1.1 billion by 2030, with a CAGR of 13.4%. The no-adhesive TCB technology reduces contamination and enhances reliability, with suppliers like Hanmi, ASMPT, Kulicke & Soffa (K&S), and BESI actively expanding in this area [6]. Hybrid Bonding: Disruptive Technology - Hybrid bonding is one of the most disruptive backend technologies today, enabling ultra-fine pitch below 5 µm without solder bumps, essential for AI, HPC, and chip-based designs. The market for this segment is projected to reach about $477 million by 2030, with a CAGR of 24.6%. Industry leaders like TSMC, Intel, and Samsung are early adopters, while BESI's strategic partnerships position it at the forefront of equipment innovation [7]. Die Attach and Flip Chip Bonder - Traditional die attach machines continue to evolve, offering ±1 µm placement accuracy and enhanced thermal control. By 2030, revenue from die attach machines is expected to reach $912 million, driven by automotive, consumer electronics, and industrial applications [7]. Flip Chip Bonder - Flip chip bonders are crucial for both traditional and advanced high-density packaging, with market size projected to exceed $662 million by 2030. Innovations like no-adhesive processes and ultra-fine pitch interconnects are enhancing I/O density and electrical performance [8]. Wire Bonding - Despite its maturity, wire bonding technology has broad application prospects, particularly in cost-sensitive and traditional applications. Advances in ultra-fine wire (<15 µm), copper bonding, and advanced loop control are driving its evolution. K&S is expected to maintain a strong market position, with revenue projected to grow slightly to about $994 million by 2030 [8]. Wafer Thinning and Cutting - The demand for thinning and cutting technologies is strong due to shrinking device sizes and the surge in wafer-level packaging. By 2030, the wafer thinning market is expected to grow to over $890 million, driven by ultra-thin grinding (<50 µm) and plasma-assisted dry thinning technologies [11]. The cutting market is projected to reach approximately $2 billion, with laser and plasma cutting gaining popularity for their precision and reduced debris [11]. Metrology and Inspection - Metrology and inspection equipment ensure yield, reliability, and compliance with strict quality standards, especially in automotive and HPC sectors. By 2030, this field's revenue is expected to grow to about $850 million, driven by defect classification and high-resolution optics [12]. Key Market Participants and Investments - The growth of backend equipment technology is supported by strategic investments from OSAT suppliers and IDM manufacturers. Leading OSAT firms like ASE, Amkor, JCET, and SPIL are expanding capacity to meet advanced packaging demands, while foundries and IDM manufacturers are investing heavily in HBM, chiplets, and hybrid bonding technologies [19]. Equipment suppliers like K&S, BESI, ASMPT, DISCO, and Hanmi are driving technological advancements and expanding product offerings [19]. Conclusion - The backend equipment market is expected to exceed $9 billion by 2030, driven by a 7.1% CAGR and transformative packaging technologies. While traditional processes remain vital, TCB, hybrid bonding, wafer thinning, and advanced cutting technologies are propelling market growth. This evolution reflects a broader industry shift towards HPC, AI, automotive, and 5G applications, emphasizing performance, density, and reliability [21].