Core Viewpoint - The article emphasizes the strategic opportunity in the new generation of chip development, highlighting the upcoming Heterogeneous Integration Annual Conference organized by TrendBank to foster advanced electronic information industry growth in Ningbo and the Yangtze River Delta region [5]. Group 1: Research Directions - The company is focusing on various research areas, including photolithography technology, advanced packaging, and polyimide materials, with specific reports scheduled for 2026 [2][3]. - A series of databases related to photolithography, polyimide projects, advanced IC substrates, advanced packaging, perovskite photovoltaics, and polarizers will be updated quarterly [3]. Group 2: Upcoming Conference - The Heterogeneous Integration Annual Conference will take place from November 17-19, 2025, with the theme "Focusing on the Frontier of Heterogeneous Integration Technology, Advancing the Journey of Advanced Packaging" [5]. - The conference will cover core technologies such as multi-material heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and advanced packaging techniques like TGV and FOPLP [5].
2026年势银泛半导体数据产品及研究计划发布
势银芯链·2025-10-14 05:21