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行业聚焦:全球半导体底部填充胶市场头部企业份额调研(附Top 10 厂商名单)
QYResearch·2025-10-16 02:18

Core Viewpoint - The semiconductor underfill market is expected to grow significantly, driven by the increasing demand for high-performance and reliable chips in modern electronic products, with a projected market size of $1.44 billion by 2031 and a CAGR of 11.2% from 2025 to 2031 [2][13]. Market Overview - Semiconductor underfill is a material used in semiconductor packaging to fill the gaps between chips and substrates, enhancing mechanical strength, thermal conductivity, and thermal cycling stability [1]. - The demand for underfill materials is increasing due to the miniaturization of electronic devices and the need for advanced packaging technologies such as 3D packaging and system-in-package (SiP) [1]. Market Size and Growth - The global semiconductor underfill market is projected to reach $1.44 billion by 2031, with a compound annual growth rate (CAGR) of 11.2% [2]. - The wafer/panel-level underfill is the dominant product type, accounting for approximately 65.2% of the market share [10]. Key Players - Major manufacturers in the global semiconductor underfill market include NAMICS Corporation, Henkel, Panasonic, Resonac, Shin-Etsu Chemical, and others, with the top ten companies holding about 73.0% of the market share in 2024 [7]. Application Segmentation - Consumer electronics represent the largest demand source for underfill materials, holding approximately 46.6% of the market share [12]. Market Drivers - The growth of the semiconductor underfill market is primarily driven by the increasing demand for high-performance and reliable chips due to advancements in technologies such as 5G, artificial intelligence, and the Internet of Things (IoT) [13]. - The development of advanced packaging technologies, including 3D packaging and flip-chip packaging, further increases the demand for underfill materials [13]. Challenges and Risks - The production process of underfill materials is complex, requiring continuous innovation in material selection, formulation, and manufacturing processes to ensure high quality and stability [14]. - Fluctuations in raw material prices and global supply chain disruptions may impact market dynamics, especially in uncertain economic conditions [14]. Downstream Demand Trends - The demand for semiconductor underfill materials is growing in various sectors, including consumer electronics, communication devices, and automotive electronics, driven by the increasing need for miniaturized and high-performance chips [15]. - The automotive electronics sector is particularly influenced by the rapid development of autonomous driving technologies, which significantly boosts the demand for high-performance semiconductors [15].