势银芯链·2025-10-17 01:42Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and the Yongjiang Laboratory, focusing on the strategic opportunities in the new generation of chip development and the importance of heterogeneous integration technology in the semiconductor industry [7][8]. Event Details - The conference will take place from November 17-19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo [8]. - The event aims to gather industry and research experts to discuss advanced packaging technologies and promote collaboration between the semiconductor industry and research institutions [9]. Conference Agenda - The agenda includes various sessions on topics such as CIS heterogeneous integration processes, 2.5D/3D chip integration, and the impact of artificial intelligence on chip interconnects [3][4]. - Keynote speeches will be delivered by government leaders and representatives from the organizing bodies [3]. Focus Areas - The conference will emphasize multi-material heterogeneous integration, optoelectronic integration, and advanced packaging technologies, including TGV (Through Glass Via) and FOPLP (Fan-Out Panel Level Packaging) [9]. - Discussions will also cover challenges and innovations in semiconductor materials and equipment [9]. Registration and Fees - The registration fee is RMB 2500 per person, with early bird discounts available for those who register before October 31 [10]. - Special pricing is offered for students at RMB 1500 [10].