硅芯科技亮相湾芯展，携生态伙伴共启先进封装“芯”篇章

Core Viewpoint - The article highlights the significance of the 2025 Bay Area Semiconductor Industry Ecological Expo, showcasing advancements in semiconductor technology and the importance of collaboration in the industry [2][10]. Group 1: Event Overview - The 2025 Bay Area Semiconductor Industry Ecological Expo (Bay Chip Expo) commenced on October 17, 2023, at the Shenzhen Convention Center, attracting over 60 leading companies and institutions from more than 20 countries, with more than 48,300 professional visitors on the first day [2][10]. - The expo features a comprehensive display platform covering the entire industry chain, including technology research and development, process implementation, and industrial application [4][10]. Group 2: Focus Areas and Innovations - The expo emphasizes advanced packaging technologies, showcasing the transition from "continuing Moore's Law" to "beyond Moore's Law," with a complete industry chain map from materials and equipment to packaging applications [10]. - Key topics include heterogeneous integration, optoelectronic fusion, 3D heterogeneous integration, and advanced packaging technologies such as TGV (Through Glass Via) and FOPLP (Fan-Out Panel Level Packaging) [30]. Group 3: Industry Collaboration and Future Directions - The Ningbo Membrane Intelligence Information Technology Co., Ltd. is the sole registered entity for TrendBank, indicating a structured approach to industry collaboration [1]. - A significant conference on heterogeneous integration technology will be held from November 17-19, 2025, in Ningbo, aiming to foster collaboration and innovation in the semiconductor industry [30].