半导体行业观察·2025-10-18 00:48Core Viewpoint - Pingshan District in Shenzhen is strategically positioned as a "Silicon-based Semiconductor Cluster" and is developing a distinctive semiconductor and integrated circuit system, with over 200 quality enterprises in the industry chain, achieving double-digit growth in output value for three consecutive years, and expected to exceed 10 billion in chip manufacturing output in 2024 [1][3]. Group 1: Semiconductor Manufacturing - Pingshan is the earliest administrative district in Shenzhen to focus on chip manufacturing, consistently accounting for over 60% of the city's output value [3]. - SMIC Shenzhen, established in 2008, has expanded to two production lines, covering 8-inch and 12-inch wafer manufacturing, creating a combination of "characteristics + scale" advantages [3]. - The ongoing major project by Pengxinxu focuses on 40nm/28nm mature logic process capacity, enhancing global wafer manufacturing services [3]. - The completion of the Fuman Microelectronics packaging project in June 2024 will provide an annual packaging capacity exceeding 8 billion units, forming a complete industry chain from wafer manufacturing to chip packaging [3]. Group 2: Industry Ecosystem and Segmentation - Pingshan leverages its core advantages in chip manufacturing to attract quality enterprises like Fuman Microelectronics and Hongxin Yucun, fostering collaboration within the industry chain [5]. - The district has established five key segments: integrated circuit equipment and core components, integrated circuit design, power devices, optoelectronic devices, and memory devices [5]. Group 3: Public Service Platforms - High-level public service platforms have been established in Pingshan to support SMEs and startups, promoting a collaborative innovation environment [7]. - Shenzhen Technology University has launched the first integrated circuit college in the Greater Bay Area, focusing on cultivating high-end talent for the semiconductor industry [7]. - The establishment of a semiconductor micro-nano processing platform at Shenzhen Technology University is expected to be operational by 2025, providing services for compound optoelectronic chips and silicon-based MEMS chips [7][8]. Group 4: Future Outlook - Pingshan aims to strengthen its foundation in silicon-based manufacturing, optical information, and integrated circuit expansion processes, targeting an annual production capacity of over 5 million wafers [9]. - The district aspires to become a core area for China's integrated circuit industry, inviting global semiconductor talents to join in its development journey [9].