三星代工发力，HBM4弯道超车海力士？

Core Insights - Samsung Electronics is preparing for final quality testing of NVIDIA's sixth-generation High Bandwidth Memory (HBM4), with its foundry division ramping up production of the logic chips that serve as the "brain" of HBM [1][2] - The logic chips for HBM4 will utilize advanced process technology, with Samsung's foundry achieving over 90% yield for 4nm process logic chips, indicating readiness for mass production [2][3] - The transition to HBM4 marks a significant shift in performance requirements, with the introduction of customized HBM expected to begin with HBM4E, necessitating tailored circuit designs based on customer needs [3][4] Summary by Sections HBM4 Production and Testing - Samsung's foundry division is fully supporting the production of logic chips for HBM4, aligning with the storage division's increased HBM4 output [1] - The foundry is increasing the wafer input for logic chips and aims to maximize yield to establish a stable production system [1] Logic Chip Technology and Yield - The logic chips for HBM4 are critical components that connect stacked DRAM with GPUs in AI semiconductors, providing power supply and data signal control [2] - The yield for 4nm process logic chips has surpassed 90%, meaning that more than 9 out of 10 chips produced are qualified, demonstrating a stable technology for large-scale production [2][3] Industry Trends and Future Outlook - The semiconductor industry is witnessing a shift towards advanced process technologies, with Samsung's 4nm process entering a mature stage and achieving an overall yield exceeding 80% [3] - The upcoming HBM4E is expected to usher in a "customized HBM" era, where HBM development will be optimized based on specific AI semiconductor applications [3][4] - The importance of foundry process technology is anticipated to increase in the next generation of HBM products, as Samsung aims to address previous product shortcomings [4]