HBM4原型，首次亮相

Group 1 - The Korea Semiconductor Industry Association will hold SEDEX 2025 from October 22 to 24 in Seoul, focusing on the theme "Beyond Limits, Connected Innovation" [1] - The main highlight of the exhibition will be the next-generation AI semiconductor roadmap announced by Samsung Electronics and SK Hynix, showcasing a prototype of the 12-layer HBM4 product intended for NVIDIA's next AI accelerator "Rubin" [2] - Samsung Electronics plans to demonstrate its capabilities as a full-solution provider, featuring a product lineup that includes HBM4, the next-generation mobile application processor Exynos 2600 manufactured with a 2nm process, system semiconductors, and wafer foundry products [2] Group 2 - SK Hynix aims to emphasize its vision as an "AI memory full-stack" supplier, with a product portfolio that includes HBM4, high-capacity DDR5 memory, Compute Express Link (CXL), and high-performance enterprise SSDs to meet the explosive data processing demands of the AI era [3] - The core strategy of SK Hynix is to solidify its market leadership by providing a complete set of core memory products required for AI data center operations [3]