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Core Viewpoint - LG Electronics is focusing on developing advanced packaging equipment to meet the increasing semiconductor demand driven by artificial intelligence (AI), aiming to localize production of AI semiconductors and high bandwidth memory (HBM) related equipment [1][2]. Group 1: Market Growth and Strategy - The post-processing equipment market is expected to grow to 43 trillion KRW (approximately 230 billion RMB) by 2030, highlighting the rising importance of advanced packaging [1]. - LG Electronics is not competing directly with existing equipment manufacturers but is instead pursuing a strategy of developing next-generation semiconductor equipment through strategic partnerships with external companies and institutions [2]. Group 2: Equipment Development - LG Electronics is developing several key types of equipment, including: - HBM-related equipment focusing on two core areas: - Hybrid bonding machines for vertical stacking of DRAM chips, with plans for commercialization by 2028 [2]. - Six-sided precision inspection equipment for detecting defects in HBM, which has already been delivered to semiconductor manufacturers [2]. - Other critical equipment includes: - LDI exposure equipment that directly draws circuits on semiconductor substrates without masks, with resolutions ranging from 1.5 to 3 micrometers [3]. - Laser equipment for ultra-precision processing of TGV holes in glass substrates and automatic optical inspection (AOI) equipment for detection [3]. Group 3: Future Outlook - The semiconductor equipment market is anticipated to experience rapid growth due to AI, with LG Electronics committed to enhancing core technologies that impact equipment performance through both domestic and international collaborations [5].