机构：车用功率半导体市场有望翻三倍

Core Insights - The electric vehicle (EV) power electronics market is projected to grow to $42 billion by 2036, tripling in size despite a slowdown in EV sales growth [1] - The adoption of SiC MOSFETs in plug-in hybrid electric vehicles (PHEVs) is increasing, offsetting the impact of slowing growth in battery electric vehicles (BEVs) [2] - The competition among SiC wafer suppliers is driving down the total cost of SiC MOSFETs, with several companies expanding their production capacity [3] - GaN technology is gaining traction in the automotive sector, with applications in onboard chargers and traction inverters expected to grow significantly [4][5] - Hybrid inverters and embedded power modules are emerging trends that could enhance power density in power electronics [6][7] Market Trends - Despite a slowdown in BEV sales, the market penetration of electric vehicles continues to rise, indicating a robust demand for SiC MOSFETs [2] - Major OEMs like Toyota and Schaeffler are integrating SiC MOSFETs into their PHEV systems, signaling a shift towards market maturity for this technology [2] - The cost of SiC wafers, which can account for up to 50% of the total cost of SiC MOSFET chips, is decreasing due to increased competition among suppliers [3] Technology Developments - GaN technology is being applied in various automotive components, including LiDAR and onboard chargers, with significant improvements in power density [4] - The first application of GaN in an onboard charger is expected in the Chang'an Qiyuan E07 model, set to launch in 2026, showcasing a power density of 6 kW/L [4] - Companies are also developing GaN-based traction inverters, although commercial deployment is anticipated to lag behind onboard chargers [5] Future Directions - Hybrid inverters are seen as a key development for the application of wide bandgap semiconductors in electric vehicles, optimizing performance while reducing costs [7] - Embedded power modules are expected to enhance power density by integrating power semiconductor chips into printed circuit boards, although large-scale production in road vehicles is not yet realized [7]