爆料！长鑫存储LPDDR5X发布，还将推出业内最薄封装！

Core Insights - The article discusses the advancements made by Changxin Storage in the field of smart manufacturing and chip talent cultivation, particularly highlighting the launch of the LPDDR5X series products and the development of a new ultra-thin LPDDR5X chip [2][4] - The packaging innovations, such as uPoP and HiTPoP, are positioned as key strategies for domestic mobile industry breakthroughs, enhancing performance and compatibility with existing designs [4] Product Development - Changxin Storage has officially launched the LPDDR5X series, which includes various packaging solutions with capacities of 12GB, 16GB, 24GB, and 32GB, and speeds ranging from 8533Mbps to 10677Mbps [2] - A new LPDDR5X product with a thickness of only 0.58mm is under development, which, if successfully mass-produced, will be the thinnest LPDDR5X product in the industry [2] Packaging Technologies - The article outlines two mainstream packaging methods: POP (Package on Package) and MCP (Multi-Chip Package), with the former being used for high-density stacking of logic chips and DRAM, while the latter integrates similar chips in one package [3] - The uMCP packaging is highlighted as an upgraded version of MCP, emphasizing heterogeneous integration and complexity, but it faces challenges such as long testing cycles and dependency on imports [3] Innovation and Market Impact - The HiTPoP packaging technology is being developed to improve DRAM high-speed IO performance bottlenecks while ensuring compatibility with existing motherboard designs [4] - The innovations in packaging are seen as crucial for breaking through in the domestic mobile industry, with Changxin Storage's technologies promoting vertical collaboration among storage, computing, and packaging sectors, thereby accelerating the localization of terminal products [4] - The successful mass production of Changxin Storage's innovative LPDDR5X products is expected to narrow the technological gap with leading DRAM manufacturers and significantly impact the autonomy of the domestic electronic supply chain [4]