Smarter Energy(SH:600869) DT新材料·2025-10-26 14:26Core Viewpoint - The article highlights the innovative cooling solution developed by Far East Holdings, which integrates biomimetic manifold microchannel technology and high thermal conductivity interface composite materials to address the thermal management challenges of next-generation GPUs and CPUs in the context of increasing chip power density [2][4]. Group 1: Technology Innovation - Far East Holdings has achieved significant advancements in cooling technology through years of research and development, proposing a system-level innovation that combines structural and material enhancements for efficient cooling solutions [2][4]. - The biomimetic manifold microchannel architecture is inspired by natural vascular and leaf vein networks, allowing for rapid and uniform distribution of coolant at the chip base, significantly improving convective heat transfer and reducing pressure drop [4][6]. - The introduction of high thermal conductivity interface composite materials creates an embedded thermal pathway that effectively lowers interface thermal resistance and in-plane temperature differences, enhancing heat extraction from high heat generation areas [4][6]. Group 2: Performance Metrics - Under water cooling conditions with an inlet water temperature of 40°C and a flow rate of only 2 L/min, the cooling system can stably dissipate 2300 W, maintaining the chip's maximum temperature at 86.8°C with an in-plane temperature difference of less than 5°C [6][7]. - Compared to mainstream single-phase cold plates with a typical limit of 1000 W, this new solution demonstrates a significant performance advantage with lower pump energy consumption, leading to a breakthrough in energy efficiency [7][8]. Group 3: Market Application and Collaboration - The technology is applicable in critical areas such as next-generation GPU/CPU liquid cooling acceleration cards, data center servers, high-power power electronics, and RF chips, providing robust support for stable operation of computing devices [8][9]. - Far East Holdings is collaborating with leading domestic chip companies and mainstream cloud operators to advance the development and testing of new liquid cooling technologies, emphasizing its commitment to energy-saving and carbon reduction in data centers [9]. Group 4: Industry Engagement - Far East Holdings will participate in the upcoming 6th Thermal Management Industry Conference and Exposition on December 3, 2025, to share insights on its latest liquid cooling technologies and invite industry partners for collaboration [10][11].