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Core Insights - The article discusses the anticipated commercialization of advanced semiconductor packaging technologies, driven by the explosive growth in artificial intelligence (AI) and high-performance computing (HPC) demands, expected to begin next year [1][2]. Group 1: Advanced Packaging Technologies - The TechInsights report highlights five key technologies that will lead the future market: Co-Packaged Optics (CPO), next-generation HBM4, glass substrates, Panel Level Packaging (PLP), and advanced thermal management solutions [1][2]. - CPO technology integrates optical transceiver modules directly into or near the chip, significantly improving energy efficiency compared to traditional pluggable optical modules. Major companies like TSMC, NVIDIA, and Broadcom are preparing for CPO commercialization, with 2026 expected to be a pivotal year for this technology [1][2]. Group 2: HBM4 and Glass Substrates - HBM4 is recognized as one of the most advanced 3D packaging technologies, maximizing high bandwidth memory performance while facing challenges in stacking yield. The industry is compelled to develop new packaging processes and material systems due to increasing thermal management and production efficiency issues [2]. - The shift from traditional silicon substrates to glass substrates is accelerating, as glass substrates offer higher stability and better wiring performance, becoming the ideal choice for high-end packaging [2]. Group 3: Panel Level Packaging and Thermal Management - PLP is gaining attention for its significant production efficiency and cost advantages, prompting global companies to increase investments in this area. This trend is expected to drive equipment investment, supply chain restructuring, and intensified competition in technology standardization [2]. - Advanced thermal management technologies, including liquid cooling, high-performance thermal interface materials (TIM), and backside power delivery, are being rapidly introduced in data centers and are expected to expand into mobile and consumer electronics [2].