SINOMACH-PI(SZ:002046) 材料汇·2025-10-27 15:51Core Viewpoint - The article discusses the development and investment landscape of diamond-based composite materials, highlighting various companies involved in this sector and their technological advancements. Company Overview - Changsha Shenghua Microelectronics Materials Co., Ltd. specializes in high-performance electronic packaging materials, including tungsten-copper and molybdenum-copper composites, with thermal conductivity reaching 600-800 W/m·K. The company has entered the supply chains of major players like Huawei and BYD for applications in 5G base stations and electric vehicles [5]. - Nanjing Ruiwei New Materials Technology Co., Ltd. focuses on new materials for chip cooling, collaborating with Nanjing University of Aeronautics and Astronautics. The company provides comprehensive thermal management solutions through thermal design and testing [6]. - Xinfeng Advanced Materials is a subsidiary of Hunan Xinfeng Technology, established in 2019, specializing in semiconductor materials and diamond-based composites. The company aims to produce 50 tons of high-performance low-cost diamond-copper materials by 2024, with plans to expand to 150 tons by 2025 [8]. - Ningbo Saime Technology Co., Ltd. was founded in 2018, focusing on lightweight, high-thermal-conductivity composite materials for applications in power chip packaging and 5G communications [9]. - Anhui Shangxin Crystal Technology Co., Ltd. specializes in high-end refractory metals and diamond-copper/aluminum composites, with a focus on medical and optical applications [12]. Investment Landscape - Various companies have secured funding rounds, indicating a growing interest in diamond-based composite materials. For instance, Nanjing Ruiwei completed an A+ round with several million yuan in funding [9]. - Ningbo Saime Technology has also attracted investment from major players like Jiangxi Copper Group, reflecting the strategic importance of this sector [10]. - Haitexin New Materials Technology Co., Ltd. is set to become a leading manufacturer of microelectronic packaging materials, with significant investments in production facilities [17]. Technological Advancements - Companies are leveraging advanced technologies such as chemical vapor deposition (CVD) and high-pressure high-temperature (HPHT) processes to enhance the performance of diamond-based materials [29]. - The thermal conductivity of diamond-copper composites is highlighted, with some products achieving thermal conductivity rates of 1800-2200 W/m·K, significantly outperforming traditional materials [30]. - The industry is witnessing innovations in manufacturing techniques, such as the development of ultra-thin diamond heat sinks and composite materials tailored for specific applications in aerospace and defense [22][24].