高密度数据中心热管理

Core Points - The "2025 Super Node Data Center Industry Summit and High-Density Data Center Developer Forum" will be held from November 26-28 in Hangzhou, Zhejiang, focusing on topics such as super node data center architecture design, interconnection technology, optical module packaging trends, liquid cooling technology, and high thermal conductivity materials [2] - The forum is organized by Cheqian Information and Thermal Design Network, expecting over 40 speakers and 500 industry experts to attend [2] - The event will feature a main conference and two specialized sessions for in-depth discussions [2] Group 1: Main Conference Topics - Core technologies and challenges of super node data centers, along with new product releases, will be discussed [3] - Presentations include topics from major companies like H3C, Intel, Huawei Cloud, and Shuguang Data Infrastructure Innovation Technology [3][4] - Innovations in AI chip interconnection protocols and the evolution of super node optical interconnection will be highlighted [4] Group 2: Specialized Session Topics - Session one will focus on optical interconnection and optical module technology, featuring companies like Zhongji Xuchuang and Fenghuo Communication Technology [5] - Session two will cover thermal management technologies for chip-server-data center integration, with discussions on GPU packaging and liquid cooling technologies [5][6] - Key challenges and strategies for high-speed optical modules in the AI era will also be addressed [6] Group 3: Additional Presentations - Various companies will present on topics such as liquid cooling solutions, energy-saving technologies, and the reconstruction of traditional data centers by super nodes [18][21] - The event will also explore the opportunities and challenges posed by AI computing on optical interconnection [16][18] - The agenda is subject to change, with final topics to be confirmed on-site [19]