半导体行业观察·2025-10-30 01:07Core Viewpoint - Toshiba's subsidiary has withdrawn from a technology cooperation agreement with a Chinese wafer supplier due to economic security concerns, highlighting the sensitivity of chip supply chains and geopolitical factors in the semiconductor industry [2]. Group 1: Toshiba's Actions and Agreements - Toshiba Electronic Devices & Storage Corporation signed a memorandum of understanding with Chinese SiC wafer supplier SICC on August 22, 2023, to enhance semiconductor quality and ensure stable wafer supply, but the agreement was terminated shortly after due to discussions between both parties [2]. - The company will continue purchasing wafers from SICC despite the termination of the agreement, indicating ongoing reliance on Chinese suppliers [2]. - Toshiba, along with Rohm, will receive up to 129.4 billion yen (approximately 851 million USD) from Japan's Ministry of Economy, Trade and Industry for investments in power semiconductor technology, crucial for electric vehicles [2]. Group 2: Collaboration with Tianyue Advanced - Toshiba has reached a basic cooperation agreement with Tianyue Advanced Technology Co., Ltd. regarding SiC power semiconductor substrates, focusing on technical collaboration and commercial cooperation to enhance the characteristics and quality of SiC power semiconductors [5]. - The collaboration aims to expand the supply of high-quality and stable substrates, with further discussions planned to finalize cooperation details [5]. - Tianyue Advanced, established in 2010, specializes in the development and production of single-crystal SiC substrates and has become a leading player in the field, with plans to release the world's first 12-inch SiC substrate in 2024 [6].