锦秋基金参与微纳核芯超亿元融资，首创三维存算一体3D-CIM™芯片开启大模型推理新篇章｜Jinqiu Spotlight

Core Insights - Jinqiu Fund has completed an investment in Micro Nano Core, a leading AI chip company specializing in 3D integrated computing-in-memory (CIM) technology [2][4][12] - The investment highlights the market's strong consensus on the disruptive potential of 3D-CIM™ technology in AI computing applications, aiming to enhance edge AI capabilities [4][6] - The global market for edge AI chips is projected to grow significantly, from $2 billion in 2024 to $16.7 billion by 2028, driven by the increasing demand for high-performance, low-power, and cost-effective solutions [6][7] Investment Overview - Micro Nano Core has successfully completed over 100 million yuan in Series B strategic financing, led by BlueRun Ventures, with participation from top-tier institutions including Jinqiu Fund [4] - The funding will support the development of the world's fastest mass-producible 3D edge AI chips, which are expected to unlock new AI application scenarios [4][9] Technology and Innovation - Micro Nano Core's 3D-CIM™ chip technology combines 3D near-memory computing and computing-in-memory (CIM) to achieve significant improvements in performance, power efficiency, and cost [8][12] - The company claims to have achieved over 4 times the computing density and more than 10 times the power reduction compared to traditional von Neumann architectures [8][9] - The RV-CIM™ full-stack technology addresses the usability of chips, ensuring compatibility with the RISC-V open-source ecosystem [8][10] Market Trends - The evolution of AI agents from execution tools to decision-making partners is expected to drive a revolution in various industries, with a target of 70% penetration of intelligent terminals by 2027 in China [6] - The demand for high-performance, low-power, and low-cost chips is critical for the widespread adoption of AI agents, with the industry consensus leaning towards 3D stacking as a solution [7][8] Team and Ecosystem - Micro Nano Core boasts a world-class innovation team with a strong track record in chip design, having published numerous record-breaking results in international competitions [10][13] - The company is leading the development of global RISC-V CIM standards and is collaborating with multiple industry leaders to build a robust ecosystem around its technology [11][13] - The strategic partnerships with major storage and terminal manufacturers aim to create a self-sustaining ecosystem that enhances the adoption of 3D-CIM™ chips across various applications [11][12]