国产先进封装的协同进程，究竟走到了哪一步？

Core Viewpoint - The article emphasizes the shift in the semiconductor industry from single-point breakthroughs to system-level collaboration, particularly in advanced packaging and chiplet technologies, driven by the increasing demand for computing power and the need for integrated solutions [4][5][15]. Industry Trends - The demand for computing power is surging, leading to a transition from "process racing" to "system collaboration" in the semiconductor industry [2][4]. - The Bay Area Semiconductor Industry Expo showcased the trend of system-level collaboration, with a focus on Chiplet and advanced packaging ecosystems [2][6]. System Collaboration - Advanced packaging competition is evolving from single-link breakthroughs to full-chain collaboration, necessitating synchronized advancements across design, EDA, manufacturing, and testing [4][14]. - EDA tools are becoming central to connecting design and manufacturing processes, crucial for the successful implementation of Chiplet and advanced packaging technologies [4][5]. Strategic Opportunities for China - China faces a strategic window to leverage its capabilities in packaging, design, and EDA, despite limitations in process technology [5][15]. - The establishment of collaborative mechanisms will define the future of domestic advanced packaging [5][11]. Collaborative Ecosystem - The "Chiplet and Advanced Packaging Ecosystem Zone" at the Bay Area Expo represented a significant step towards creating a visible collaborative framework involving nearly 30 entities [6][11]. - The integration of EDA platforms with real-time collaboration between design and manufacturing is being pursued to enhance system modeling and verification [8][10]. Pathway to Systematic Collaboration - The transition from "small closed loops" to "large systems" reflects a replicable collaborative model, moving from localized validation to systematic implementation [12][14]. - A cross-enterprise, cross-process, and cross-disciplinary collaborative framework is emerging, essential for the self-evolution of China's advanced packaging industry [14][15]. Innovation and Ecological Restructuring - Collaboration is becoming the foundational logic of China's advanced packaging sector, driving innovation and supporting systemic evolution [15][16]. - The redefinition of the innovation order and ecological landscape in the semiconductor industry is underway, led by domestic players like Silicon Core Technology [17][18].