国际国内键合设备厂商齐聚宁波，共探Hybrid Bonding异构集成技术趋势

Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and Yongjiang Laboratory, focusing on advancements in heterogeneous integration technology and its applications in semiconductor packaging [4][16]. Group 1: Event Details - The 2025 Heterogeneous Integration Annual Conference will be held from November 17-19, 2025, in Ningbo, Zhejiang [4][16]. - The conference aims to gather 300-500 participants and will feature various discussions on hybrid bonding and advanced packaging technologies [16]. - Early bird registration is available until October 31, with ticket prices ranging from RMB 1500 for students to RMB 2500 for general attendees [17]. Group 2: Industry Trends - Heterogeneous integration technology is rapidly evolving, transitioning from 2D to 2.5D and 3D integration, with major companies like Sony, TSMC, Samsung, Intel, and AMD actively developing these processes [2][3]. - The article highlights the advancements in bonding techniques, with C4 bump pitch decreasing from 150-110μm in 2D integration to 8-2μm in 3D stacking, indicating a trend towards finer pitches and higher integration [3]. Group 3: Conference Topics and Speakers - The conference will include discussions on various topics such as AI-driven advanced packaging processes, challenges in multi-dimensional heterogeneous integration, and the future of chiplet interconnect design [12][14]. - Confirmed speakers include industry leaders from companies like Qinghe Crystal, Xinhui Lianxin, and Maiwei Technology, who will present on topics related to semiconductor hybrid bonding and advanced packaging technologies [6][12].