国内唯一一家2.5D硅基芯片封装技术大规模量产企业，IPO获受理

Core Viewpoint - The article highlights the successful IPO application of Shenghe Jingwei Semiconductor Co., Ltd. on the Sci-Tech Innovation Board, marking a significant milestone for the advanced packaging industry in China, particularly in the context of the AI era [1]. Group 1: Company Overview - Shenghe Jingwei, established in August 2014, focuses on 3D chip integration processing and is the first in the world to adopt an integrated circuit front-end chip manufacturing system [3]. - The company has achieved significant advancements in the mid-stage silicon wafer processing sector, being one of the earliest in mainland China to achieve mass production of 12-inch bump processing [3]. - As of the end of 2024, Shenghe Jingwei is projected to have the largest 12-inch bump processing capacity in mainland China [3]. Group 2: Market Position and Financial Performance - In the wafer-level chip-scale packaging (WLCSP) sector, Shenghe Jingwei is expected to lead the market in 2024 with a revenue scale of approximately 31% market share in mainland China [3][4]. - The company has shown robust revenue growth, with projected revenues of approximately 30 billion yuan in 2023, up from 16 billion yuan in 2022, and expected to reach around 47 billion yuan in 2024, reflecting a compound annual growth rate of 69.8% over three years [5]. Group 3: Technological Advancements and Future Development - The rapid growth of artificial intelligence has created a significant demand for chip computing power, with the need for processing capabilities doubling every 3 to 4 months, surpassing the traditional Moore's Law [6]. - Shenghe Jingwei is focusing on 3D integration technology, which offers higher interconnect density and improved chip performance compared to 2.5D technology [6][7]. - The company is actively advancing its 3DIC research and industrialization, with plans to enhance its production capacity for ultra-high-density interconnect three-dimensional multi-chip integration packaging [7].