格创东智引领先进封测新世代：从自动化到自主化的演进之路

Core Insights - The article emphasizes the rapid growth of advanced packaging in the semiconductor industry, driven by applications like AI chips and high-performance computing, which present unprecedented challenges for traditional packaging technologies [2][3] - It highlights the complexity of advanced packaging processes, which require deep integration of wafer manufacturing and packaging testing, and the need for digital transformation to enhance efficiency and quality [2][3][4] Challenges in Advanced Packaging - Advanced packaging faces five major challenges: flexible manufacturing, multi-site collaboration, policy environment, integration issues, and market pressure, which are fundamentally management and strategic problems [3][4] - The increasing complexity of processes due to emerging applications like AI, IoT, and 5G is reshaping the semiconductor landscape, necessitating rapid market entry for new products [3][4] Digital Transformation Solutions - The company proposes a systematic solution for digital transformation, emphasizing the integration of technology with business to address real customer issues [6][7] - A shift from technology-driven to business-driven approaches is crucial for successful transformation, as demonstrated by TCL's intelligent manufacturing strategy [6][7] AI and Automation in Manufacturing - The introduction of a fully automated CIM solution tailored for advanced packaging, integrating AI, CIM, and AMHS, is a significant development [9][10] - The article discusses the importance of identifying suitable value scenarios for AI projects, as many fail to deliver value due to poor data quality or unclear objectives [10][11] Strategic Importance of Domestic Solutions - The company's fully domestic solution addresses security risks associated with reliance on foreign suppliers, promoting innovation and collaboration within the semiconductor industry [13][14] - The focus on system collaboration aims to eliminate data silos and enhance operational efficiency by integrating IT and OT systems [13][14] Conclusion and Future Outlook - The article concludes with four core experiences for intelligent manufacturing transformation: shifting to business-driven approaches, optimizing operational costs, integrating lean thinking, and effectively utilizing AI technology [16] - The company aims to lead in the advanced packaging sector, advocating for digital transformation to support the high-quality development of China's semiconductor industry amidst geopolitical uncertainties [16]