半导体行业观察·2025-11-02 02:08Core Insights - The conference focuses on the latest trends and innovations in the semiconductor industry, particularly in AI, EDA, and advanced packaging technologies [1][2][3]. Group 1: Opening Ceremony and Keynote Speeches - The opening ceremony featured leaders from various semiconductor organizations, emphasizing the importance of innovation in driving industry upgrades [1]. - Keynote speeches included topics such as the role of AI in semiconductor design and the development of resilient semiconductor value chains [1][2]. Group 2: Semiconductor Development Trends - Discussions highlighted the acceleration of AI-driven Chiplet ecosystems and the importance of EDA tools in the AI era [2][3]. - Presentations covered advancements in AI ASIC platforms and the integration of reconfigurable chips into computing nodes [2][3]. Group 3: Advanced Packaging and Testing - The conference addressed the evolution of advanced packaging technologies, including 2.5D/3D EDA as a bridge for design and process innovation [4][5]. - Topics included the challenges and opportunities in testing advanced packaging solutions and the impact of AI on testing methodologies [4][5]. Group 4: EDA and IC Design Services - The agenda included discussions on the integration of AI in EDA tools, enhancing chip design productivity and efficiency [36][37]. - Presentations focused on the development of domestic EDA platforms and their role in the post-Moore era of three-dimensional multi-chip system design [36][37]. Group 5: Industry Collaboration and Future Directions - The conference emphasized the need for collaboration among industry players to drive innovation and address challenges in semiconductor design and manufacturing [1][2]. - Future trends discussed included the potential of RISC-V architecture in AI applications and the importance of modular and high-performance computing solutions [2][3].