2.5D先进封装散热挑战与创新解决方案

Core Viewpoint - The article emphasizes the critical role of thermal interface materials (TIMs) in addressing the heat dissipation challenges posed by 2.5D packaging in high-performance computing, highlighting the need for innovative solutions to enhance thermal management efficiency [2][4]. Group 1: Challenges in 2.5D Packaging - The 2.5D packaging architecture presents unprecedented complexity in heat transfer paths and thermal stress distribution, facing three main challenges: increased heat flow density, interface material pump-out due to height differences, and warping of chips leading to poor interface contact [3]. - Thermal interface materials are pivotal in the heat dissipation chain, accounting for over 60% of interface thermal resistance, making them a key element in solving thermal management issues [4]. Group 2: Requirements for Thermal Interface Materials - TIMs must possess ultra-high thermal conductivity to handle significant temperature rises and exceptional compliance to compensate for chip warping and height differences among multiple chips [6]. - Traditional high-performance materials like silicone grease and indium foils struggle to meet both reliability and compatibility requirements for larger sizes [6]. Group 3: Innovations by Hongfucheng - Hongfucheng has developed graphene thermal pads that address the core pain points of TIMs for 2.5D packaging, offering a solution characterized by high thermal conductivity (130 W/mK), low thermal resistance (as low as 0.04 °C・cm²/W), excellent compressibility (up to 70%), and long-term reliability due to the chemical inertness of graphene [7]. - The application of Hongfucheng's graphene thermal pads directly on the back of core chips like GPUs and HBM provides three key benefits: effective heat conduction across height differences, suppression of warping effects, and simplification of manufacturing processes by eliminating the need for gold plating and reflow soldering, thus significantly reducing production costs and time [9].