BYD(SZ:002594) 材料汇·2025-11-04 14:54Core Insights - The article emphasizes the critical role of heat dissipation technology in high-power and high-density electronic devices, highlighting the shift from traditional materials to diamond-copper composite materials as a solution to thermal management challenges [1][3][4]. Group 1: Heat Dissipation Technology - Heat dissipation systems have evolved from being performance optimization components to core constraints on product performance, driven by the exponential increase in heat flow density [4][11]. - Traditional heat pipe technologies face significant limitations, with performance degradation exceeding 40% in complex applications, necessitating the development of high-performance composite materials [11][12]. Group 2: Market Dynamics and Challenges - The article outlines the challenges faced in various sectors, including AI chips, electric vehicles, and 5G base stations, where heat flow densities exceed 300 W/cm², leading to significant performance losses and increased operational costs [10][12][13]. - The economic implications of heat management are underscored, with data indicating that a 10°C increase in temperature can reduce reliability by 50%, emphasizing the need for effective thermal solutions [7][13]. Group 3: Diamond-Copper Composite Materials - Diamond-copper composite materials are identified as a breakthrough solution, combining the high thermal conductivity of diamond with the workability and electrical conductivity of copper, achieving thermal conductivities exceeding 1000 W/m·K [18][22]. - The material's advantages include precise thermal expansion matching, which mitigates interface cracking issues, and excellent environmental adaptability, making it suitable for extreme conditions [22][23]. Group 4: Industry Landscape and Growth Potential - The diamond-copper industry is characterized by a complete supply chain in China, with over 90% domestic production, and a significant profit margin in the midstream manufacturing segment [35]. - The global market for diamond-copper composites is projected to grow from $160-190 million in 2024 to $350-380 million by 2030, driven by high heat flow density applications in AI, electric vehicles, and 6G communications [36][37]. Group 5: Competitive Landscape - The competitive landscape shows a dichotomy where international giants dominate high-end markets while domestic companies accelerate local replacements, focusing on cost control and technological advancements [45]. - Key players include Japan's Sumitomo Electric, which holds a significant market share, and various Chinese firms that are entering supply chains of major companies like Huawei and BYD [45]. Group 6: Future Trends - Future developments are expected to focus on technological breakthroughs and the expansion of application scenarios, with an emphasis on integrating multiple manufacturing processes and enhancing performance in both consumer and aerospace markets [53][54].