蒋尚义：芯片的未来在Chiplet和先进封装

Core Insights - AI is identified as a new driving force for the future of the semiconductor industry, transitioning from traditional computing to AI applications, which are still in the foundational stage but will diversify significantly in the coming years [2][3] - The shift towards AI applications will challenge traditional chip design economies of scale, necessitating new approaches such as Chiplet architecture to manage development costs and enhance market flexibility [3] - Advanced packaging technologies are becoming critical for performance enhancement, with a focus on system design as a key area for future development in the semiconductor sector [3] Group 1 - AI is redefining the meaning of Moore's Law, moving from centralized data centers to edge computing and AIoT applications, which will include smart cars, robots, smart homes, and smart cities [2] - The cost of designing advanced chips, such as TSMC's products below 5nm, can reach approximately $2 billion, making it unfeasible for companies to invest heavily without guaranteed sales [3] - The Chiplet concept allows for modular design, enabling the reuse of high-performance modules across various products, thus distributing development costs and increasing market adaptability [3] Group 2 - The semiconductor industry is approaching physical limits of Moore's Law, with the pace of process miniaturization slowing down, which may challenge Taiwan's leading position in wafer foundry and packaging [3] - Advanced packaging technologies like CoWoS and InFO are becoming essential for improving chip integration efficiency, shifting the focus from merely cost control to performance enhancement [3] - System design is emphasized as a crucial area for future focus, as it will ultimately dictate the direction of industry development [3]