3nm，抢爆了

Core Insights - TSMC's 3nm process has officially entered a golden mass production phase, with third-quarter revenue contribution rising to 23%, surpassing the 5nm process and becoming a key driver for overall operations [2] - The demand for AI and cloud applications is driving TSMC's 3nm production lines to operate at full capacity, with utilization rates at the Tainan Fab18 facility nearing maximum [2] - NVIDIA is a major contributor, increasing its monthly wafer orders to 35,000, which is straining the advanced process capacity [2] Group 1 - TSMC's monthly 3nm production capacity has rapidly increased from 100,000 wafers at the end of last year to 100,000-110,000 wafers, with projections to reach 160,000 wafers by 2025, representing a nearly 50% increase [2] - Major cloud service providers (CSPs) are competing for 3nm capacity, with AWS and Google planning to utilize TSMC's 3nm process for their AI chips [2] - The semiconductor industry anticipates challenges in 3nm wafer supply next year, as CSPs like Google seek to secure more wafer allocations [3] Group 2 - TSMC's 3nm process is expected to account for over 30% of its revenue next year, driven primarily by AI and high-performance computing (HPC) [3] - TSMC plans to increase prices for advanced process technology by 3-5% over the next four years, reflecting strong demand for AI chips and indicating a seller's market for the most advanced wafer foundry services [3] - The introduction of improved versions of the 3nm process, such as N3E and N3P, aims to optimize performance, power consumption, and yield [3]