HBM 4，黄仁勋确认

Core Insights - Nvidia's CEO Jensen Huang announced the receipt of advanced memory samples from Samsung Electronics and SK Hynix, indicating strong support for Nvidia's growth in AI chip demand [3][4] - Huang expressed concerns about potential memory supply shortages due to robust business growth across various sectors, suggesting that memory prices may rise depending on operational conditions [3] - TSMC's CEO C.C. Wei acknowledged Nvidia's significant wafer demand, emphasizing the critical role TSMC plays in Nvidia's success [3] Memory Market Dynamics - SK Hynix, Micron, and Samsung are in fierce competition to dominate the HBM4 market, estimated to be worth $100 billion [6] - Micron has begun shipping its next-generation HBM4 memory, claiming record performance and efficiency, with bandwidth exceeding 2.8TB/s [6][7] - SK Hynix has also delivered 12-Hi HBM4 samples to major clients, including Nvidia, and plans to ramp up production [7][8] Future HBM Generations - The latest HBM generation, HBM4, supports bandwidth up to 2TB/s and a maximum of 16 layers of Hi DRAM chips, with a capacity of up to 64GB [10] - Future generations, HBM5 to HBM8, are projected to significantly increase bandwidth and capacity, with HBM8 expected to reach 64TB/s by 2038 [11][12][15] - HBM technology is evolving with new stacking techniques and cooling methods, enhancing performance and efficiency [12][13]