势银观察 | 2025年先进IC封装载板市场将实现两位数增速反弹

Group 1 - The core viewpoint of the article highlights the recovery of the global IC packaging substrate market, with a forecasted revenue of $15 billion in 2025, representing a 12% year-on-year growth, driven by surging demand in downstream technology products such as data centers and AI servers [2][3]. - The Chinese domestic market is expected to maintain a high growth rate, with projected revenue reaching $1.64 billion, and local companies achieving a global market share exceeding 10% for the first time [3]. - The 2025 Heterogeneous Integration Frontier Forum will be held from November 17-19, 2025, in Ningbo, focusing on advanced packaging and integration technologies [5][29]. Group 2 - The forum will feature a report by a senior analyst from TrendBank on the development trends of advanced packaging technologies such as 2.5D/3D/FOPLP and IC substrates [6]. - The event will include various keynote speeches and parallel forums discussing critical technologies and challenges in heterogeneous integration and advanced packaging [11][15][22]. - The forum is organized by TrendBank and the Yongjiang Laboratory, with support from various industry associations, and is expected to attract 300-500 participants [29].