势银芯链·2025-11-12 03:25Core Viewpoint - The article discusses the upcoming "2025 Heterogeneous Integration Frontier Forum" organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association, focusing on advancements and challenges in heterogeneous integration technology within the semiconductor industry [2][22]. Event Details - The forum will take place from November 17 to 19, 2025, at the Pan Pacific Hotel in Ningbo, Zhejiang, with an expected attendance of 300 to 500 participants [22]. - The event aims to facilitate discussions among industry experts, academic institutions, and investment organizations regarding the current state and future trends of advanced packaging technologies [2][22]. Agenda Highlights - The forum will feature keynote speeches, technical presentations, and parallel sessions covering various topics such as micro-nano manufacturing technologies, advanced packaging trends, and the development of optical chips [4][6][10][12]. - Notable speakers include experts from leading institutions and companies, discussing topics like 2.5D/3D advanced packaging, silicon photonic integration, and Micro LED technology [6][10][12][15]. Registration Information - Registration fees are set at RMB 2500 per person, with early bird discounts available for those who register before October 31, 2025 [22]. - Special rates are offered for students, allowing them to attend for RMB 1500 [22]. Participant List - The article lists several companies and their representatives who have registered for the event, including Huawei, Longxin Storage, and various semiconductor technology firms [23][24].