HBF，即将爆发

Core Viewpoint - The article discusses the future of high bandwidth memory (HBM) and high bandwidth flash (HBF) technologies, emphasizing their importance in the AI era and the anticipated market dynamics surrounding these technologies by 2030 [2][3]. Group 1: HBM and HBF Market Predictions - The demand for HBM is expected to increase significantly, with projections indicating that the amount of training data for AI will grow a thousandfold in the next decade, leading to a corresponding increase in HBM demand [4]. - Intel's CEO has committed to supplying 260,000 GPUs to South Korea, which will include 2.08 million HBM memory modules, highlighting the scale of investment in this sector [4]. - The total budget for cooling, power facilities, land, and other components is estimated to be around 100 trillion KRW, with the final GPU count potentially exceeding 100 million, indicating a fierce competition dubbed the "money war" [5]. Group 2: Strategic Collaborations and Supply Chain - CEO Huang Renxun's meetings with SK Hynix and Samsung Electronics are aimed at securing a stable supply of HBM, as the demand for HBM memory is expected to outstrip supply from any single manufacturer [6]. - The collaboration between SanDisk, SK Hynix, and Samsung Electronics is crucial for advancing HBF technology, which is seen as a necessary evolution from traditional DRAM due to physical limitations in memory capacity [7]. Group 3: Future Development and Research Directions - The article outlines plans for the HBF roadmap to be released in early next year, with expectations that memory revenue will surpass GPU revenue by the mid-2030s [7][8]. - The establishment of research centers focused on HBM and HBF technologies is proposed, with a call for government support to foster talent and foundational research in this field [9]. Group 4: Vision for AI and Memory Integration - The integration of HBM and HBF alongside GPUs is proposed, where HBM handles encoding tasks and HBF manages decoding tasks, reflecting a shift towards memory-centric computing [7]. - The future vision includes HBM evolving into a system semiconductor, with diverse customer needs leading to the development of AI wafer foundry and AI solution businesses [8].