HBM4E大战，提前开打

Core Viewpoint - The competition in the high bandwidth memory (HBM) semiconductor industry is intensifying, with Samsung Electronics and SK Hynix accelerating their R&D efforts for the next generation of HBM, specifically HBM4E, which is expected to shift from general products to customized solutions based on client needs [2][3]. Group 1: Market Trends and Projections - The demand for HBM is projected to grow significantly, with an annual growth rate of 77% expected next year and reaching 68% by 2027 [2]. - By 2027, HBM4E is anticipated to account for 40% of the total HBM demand, indicating a shift towards customized products [2]. Group 2: Competitive Landscape - SK Hynix is positioned as a leader in the HBM4 market, having negotiated supply agreements with Nvidia for HBM4 chips [2]. - Samsung Electronics is also preparing for the customized HBM market, leveraging its design and manufacturing capabilities to respond to diverse client needs [3]. Group 3: Industry Collaborations - Micron Technology is exploring partnerships with TSMC to enter the HBM4E market, indicating a trend towards collaboration in advanced manufacturing processes [3][4].