【大会议程|重磅嘉宾】2025集成电路特色工艺与先进封装测试产业技术论坛暨电子科技大学集成电路行业校友会年会

Core Viewpoint - The article discusses the trends and opportunities in the integrated circuit industry, particularly focusing on advancements in semiconductor technology, AI applications, and the development of advanced packaging techniques [5][6][7][8]. Group 1: Integrated Circuit Development Trends - The conference features discussions on the development trends of integrated circuits in the post-Moore era, emphasizing the importance of innovative materials and processes [5]. - Keynote speakers include prominent figures such as Wu Hanming and Li Yanrong, who address the challenges and innovations in power semiconductor technology [5][6]. Group 2: AI and Semiconductor Technology - The integration of AI in semiconductor technology is highlighted, with presentations on AI-driven advancements in power integration and the role of AI in enhancing data center efficiency [6][7]. - Discussions include the dual relationship between AI and TGV (Through Glass Via) technology, showcasing how both fields can benefit from each other [6]. Group 3: Advanced Packaging Techniques - The article outlines various sessions dedicated to advanced packaging technologies, including the development of glass substrates and their applications in integrated circuits [8]. - Experts discuss the challenges and innovations in silicon carbide (SiC) and gallium nitride (GaN) power devices, focusing on their industrialization and application in modern electronics [7][8]. Group 4: Industry Ecosystem and Collaboration - The conference emphasizes the importance of building an ecosystem for integrated circuits, involving collaboration among academia, industry, and government [10]. - The role of alumni networks in fostering innovation and investment opportunities in the semiconductor sector is also discussed [10].